Advanced SMT (Surface Mount) PCB Assembly

SMT (Surface Mount) PCB Assembly

We are adept at assembling SMT PCBs of all sizes and types, and all major classes of SMT assembly, i.e., Class II and Class III, from printing and dispensing adhesives and solder pastes to placement (mounting), reflow soldering, cleaning if needed, and inspection, and rework/repair. We can handle a wide range of SMT components from passive chip components (e.g., 01005, 0201, 0402) to active packages including Micro-BGA, LGA, QFN, QFP, CSP, Package on Package (PoP) and more with our automated state-of-the-art SMT assembly lines.


Our advanced SMT lines are capable of manufacturing complex assemblies with high-mix ratios, products with high thermal demand, HDI (High-Density Interconnect) and miniaturized assemblies. Our in-line 3D Solder Paste Inspection (SPI) and post-assembly AOI and 5-axis X-Ray equipment ensures an optimized process. We can clean or ‘no-clean’ as the process and product require, Selective Solder as required, dispense and cure adhesives and electronic materials (masks), and provide a lead-free (RoHS-compliant) assembly or leaded (Hi-Rel) as the customer requires. We are considered experts in Paste-in-Hole processes and Bonded Carrier assemblies with ¾” aluminum or copper core PCBs.

If you are reading this page, we know the reason so please call us or email us to start discussion about your advanced and complex manufacturing requirements!